Majelac Technologies provides Semiconductor Assembly and Packaging services. We offer Wafer Dicing, Die Attach, Flip Chip Attach, Wire Bonding, and Encapsulation Services. We specialize in quick turnaround IC packaging. Package capabilities include QFN, PGA, Sidebraze Dip, BGA, Open Cavity packages, custom packages. Capabilites include: Our Capabilities include > Open Cavity QFN packaging > 300 mm wafer dicing and sorting > Complex Wire bonding including aluminum, gold, copper, and heavy aluminum. > Flip Chip Assembly including thermo sonic bonding or thermo compression bonding > Precision Die attach including solder die attach and vacuum re-flow die attach > SEM service