Majelac Technologies
Semiconductor Manufacturing, Packaging, Materials Handling · 2 Employees
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About
Majelac Technologies provides Semiconductor Assembly and Packaging services. We offer Wafer Dicing, Die Attach, Flip Chip Attach, Wire Bonding, and Encapsulation Services. We specialize in quick turnaround IC packaging. Package capabilities include QFN, PGA, Sidebraze Dip, BGA, Open Cavity packages, custom packages. Capabilites include:
Our Capabilities include
> Open Cavity QFN packaging
> 300 mm wafer dicing and sorting
> Complex Wire bonding including aluminum, gold, copper, and heavy aluminum.
> Flip Chip Assembly including thermo sonic bonding or thermo compression bonding
> Precision Die attach including solder die attach and vacuum re-flow die attach
> SEM service
Website
Year Founded
2002
Social Media
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Industry
Semiconductor Manufacturing, Packaging, Materials Handling, Integrated Circuit Assembly Services, Flexible Circuit Assemblies, Electronic Assemblies, Custom Manufacturing & Fabricating, Computer-Aided & CAD/CAM Designers, General Designers, Designers
HQ Location
3070 McCann Farm Drive
Unit 110
Garnet Valley, Pennsylvania 19060, US
Keywords
Wafer DicingDie AttachFlip Chip AttachWire BondingBall BondingBGA Ball AttachHeavy WirebondingQFN PackagingOpen Cavity PackagingCeramic Assembly
Location
- 3070 McCann Farm Drive Unit 110 Garnet Valley, Pennsylvania 19060, US
Email Formats
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andywarhol@majelac.com
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awarhol@majelac.com
first + last_initial
andyw@majelac.com
first
andy@majelac.com
last
warhol@majelac.com
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