Ultra Precision Die Attach, High Speed Wafer Inking and inspection, High Speed Dispense System and Custom Solutions and more! At ASMPT AMICRA, we provide our valued customers with extraordinary, high-technological engineering services, including die and flip chip bonders as well as products for the entire industry field of microelectronics, including: active optical cable, fan-out, TSV, TCB, process development, semiconductor backend, fiber optic, LED, optoelectronics and MEMS. With our latest technology for die bonders and flip chip bonders we are able to optimize your bond process to reduce the cost of back-end packaging. Our company is headquartered in beautiful Regensburg, Bavaria, Germany.