Ultra Precision Die Attach, High Speed Wafer Inking and inspection, High Speed Dispense System and Custom Solutions and more! At ASMPT AMICRA, we provide our valued customers with extraordinary, high-technological engineering services, including die and flip chip bonders as well as products for the entire industry field of microelectronics, including: active optical cable, fan-out, TSV, TCB, process development, semiconductor backend, fiber optic, LED, optoelectronics and MEMS.
With our latest technology for die bonders and flip chip bonders we are able to optimize your bond process to reduce the cost of back-end packaging.
Our company is headquartered in beautiful Regensburg, Bavaria, Germany.
Industry
Semiconductor Manufacturing, Semiconductor manufacturing machinery and equipment, Electronic equipment. Telecommunications equipment, Electrical, Electronics & Optical, Production machinery for the electronics industry
HQ Location
Marie Curie Str. 6
Regensburg, Bavaria 93055, DE
Keywords
Die Attach and Flip Chip bondingHigh Speed Wafer Inking and inspectionHigh Speed Dispense System and Custom Solutionsand Automated LED/LD Test & Sort Systems