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Theresa Bondoc
Semiconductor Ic Product And Package Development Engineer at Bourns,
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Work Experience
Semiconductor Ic Product And Package Development Engineer
May 2017 - Present · 7 years and 7 months
Advanced Package Development Engineer
May 2015 - Apr 2017 · 1 years and 11 months
Project Leader - Advanced Packaging
Jan 2012 - Feb 2015 · 3 years and 1 months
Company Details
1001-5000 Employees
Bourns, Inc. is a leading manufacturer and supplier of automotive sensors, circuit protection solutions, magnetic products, microelectronic modules, trimming and precision potentiometers, panel controls and encoders and resistive products. Headquartered in Riverside, CA, Bourns serves a broad range of markets, including telecommunications, computer, industrial, instrumentation, automotive, consumer, non-critical life support medical, audio and various other market segments. Bourns products are manufactured according to ISO-9000 standards under Six Sigma quality programs. Bourns automotive products are manufactured in accordance with the TS16949 standard. Additional company and product information is available at the company’s website at www.bourns.com.
Year Founded
1947
Social Media
LinkedinFacebookTwitterInstagram
Industry
Appliances, Electrical, and Electronics Manufacturing, Locks, Tools & Hardware, Metallurgy & Metalworking, Locks, bolts and keys - manufacturing machinery, Cars - electrical and electronic parts and components, Material & Equipment, Vehicles & Transport Equipment, Electrical & Electronic Components, Electrical & Electronic Components
HQ Location
1200 Columbia Avenue Riverside, CA 92507, US
Keywords
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