Founded in 1998 in Silicon Valley, ACM Research, Inc. provides wet processing technology, systems, and key manufacturing products targeted to a range of semiconductor IC manufacturing and wafer-level packaging applications. The company specializes in developing cleaning technologies for advanced semiconductor device manufacturing. Known for its expertise in ultra-low-K dielectric and copper integration, the company initially focused on stress-free copper polishing technology. Its first product was introduced in 2001 and sold to leading-edge wafer manufacturers in the U.S. In 2003, to address increasing challenges in defect reduction that plagued emerging generations of IC chips, ACM Research developed its innovative single-wafer cleaning equipment, which features the company’s proprietary Space Alternated Phase Shift (SAPS™) and Timely Energized Bubble Oscillation (TEBO™) megasonic cleaning technologies. In particular, ACM’s revolutionary TEBO technology is enabling future generations of semiconductor capability. These capabilities are delivered on high-throughput chamber and platform designs. In September 2006, ACM expanded its operations into Asia, and formed the subsidiary ACM Research (Shanghai), Inc. The company offers complete R&D, and engineering and manufacturing operations at its Zhangjiang Hi-Tech Park facility in Shanghai. Product Lines IC: FEOL Single-Wafer Clean BEOL Single-Wafer Clean Backside Clean Bench PR Stripper Wet Bench Single Wafer Recycle ECP SFP Furnace Advanced WLP: Coater Developer PR Stripper Scrubber Wet Etcher ECP Furnace Wafer Manufacturing: Single-Wafer Clean Single-Wafer Wet Etcher Furnace