Plastronics Socket Partners, LP (DBA Plastronics Socket Company) has focused on solving the most challenging burn-in socket requirements since 1982 with the invention of the first open-top socket for production burn-in of LCC and PLCC packages. This allowed semiconductor manufacturers to significantly increase their throughput while decreasing costs. Through an innovate design, Plastronics’ customers were able to use automation for high volume socket loading and increase their burn-in board density by over 2x, reducing the need for costly capital equipment. Today Plastronics serves its customers through a vast portfolio of products that tackle the toughest challenges our customers face: Higher Currents Higher Frequency Larger packages with pin counts up to 3000 I/Os that are have .25mm+ in warpage Packages down to .35mm pitch between pads or balls Through state of the art design, a keen focus on automated assembly, and in-house tool and mold, Plastronics has continued to solve these problems with quality burn-in socket solutions that are cost-effective. Whether your future challenge is listed above, or a new challenge presents itself, Plastronics has the technology and the expertise to tackle the most daunting burn-in issues. We welcome all our customers to take a tour of our facilities and meet with our staff for a behind the scenes tour of our design department, tool and mold facility or assembly facility, anytime you are in the Dallas area.