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Michael Trammel
Director Of Engineering at Summit Interconnect
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Work Experience
Director Of Engineering
Dec 2019 - Present · 5 years
Dec 2014 - Present · 10 years
Director Of Engineering
Jun 2016 - Present · 8 years and 6 months
Field Application Engineer
Dec 2014 - Present · 10 years
Company Details
1001-5000 Employees
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Colorado, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn and high technology PCB & PCBA manufacturing, and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.
Year Founded
2016
Social Media
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Industry
Manufacturing, Stitch Wired Printed Circuit Board (PCB) Prototypes, Additive Manufacturing - 3D Printing, Prototypes, Custom Manufacturing & Fabricating, Printed Circuits, Circuits, Electronic Components, Automation & Electronics, Printed Circuit Board (PCB) Drilling & Routing
HQ Location
18101 Von Karman Ave Suite 1650 Irvine, California 92612, US
Keywords
Printed Circuit BoardsPCBRigidFlexPCB Assembly
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