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Martin Tůma
Sales Director
at
Argotech – Photonics & Microelectronics Packaging
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Work Experience
Argotech – Photonics & Microelectronics Packaging
Sales Director
Jan 2018 - Present · 6 years and 11 months
EZconn Czech a.s.
Sales
Jul 2006 - Dec 2017 · 11 years and 5 months
Infineon Technologies Fiber Optics
Logistics, Customer Service
Sep 2000 - Jun 2006 · 5 years and 9 months
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Company Details
Argotech – Photonics & Microelectronics Packaging
51-200 Employees
ARGOTECH provides R&D and packaging services in the field of MICROELECTRONICS and OPTOELECTRONICS. Our R&D team is active in the field of SILICON PHOTONICS.
Website
http://www.argotech.cz
Year Founded
--
Social Media
Linkedin
Industry
Appliances, Electrical, and Electronics Manufacturing, Air-Conditioning Technology, Refrigeration Supply, Purification, Cleaning Service
HQ Location
Náchodská 529 Trutnov, Královéhradecký kraj 541 01, CZ
Keywords
Electrical engineering, Electronics
Electrical engineering
Electronics
DIE BONDING - soldering or epoxy fixation
flip chip
face up
components size from 150*150 μm
placement accuracy ± 1µm
WIRE BONDING - ball-wedge
wedge-wedge
Discover More About Cleveland Clinic
Contact Details
Email Address
M**@argotech.cz
Reveal Email
Phone Number
(xxx)xxx-xxxx
Reveal Phone
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