The growing need for smaller, more cost efficient, and higher performance semiconductor packages are fueled by significant growth in the mobile, wearable and IOT device space. EoPlex meets this need with its CSI™ Products, a smart alternative to traditional leadframe technology. The CSI™ technology and process uses 3D-printed technology to print package components onto a temporary stainless steel carrier which is removed after assembly and testing. This enhances performance, and even smaller QFN packaging, and permits the use of QFN processing for packages that otherwise require more expensive and bulkier QFP and BGA options. EoPlex CSI™ Products feature: • High Lead count, up to 500 leads • Multi Row DAPs • Optimized products for low lead, high lead, power devices • Potential for use in SiP • Ultra-thin, compact packages, less than 250µ thick • Design flexibility • Standard manufacturing process compatibility • Strip test capability Want to learn more? Contact EoPlex directly at info@eoplex.com or visit www.eoplex.com.