Probe Array manufactures consumable wafer probe head assemblies for the semiconductor testing market using a patented MEMS / Photo-lithographic process. this patented breakthrough technology enables us to offer probe cards with better performance, lower costs, shorter leadtimes, and field repairability. This technology is the only large array test head process offering sub 60 micron pitch on the next generation of DRAM & flash memory wafers and today's DSP, Logic, & dispaly driver die. With our patented MMS/ PLP process we will become the "Industry Leader" for single touchdown 300 mm and 450 mm full wafer testing.