Micross is the most complete provider of advanced microelectronic services and component, die and wafer solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets. Micross is the leading global one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices.
For more than 40 years, our extensive hi-reliability capabilities have served the global Aerospace & Defense, Space, Energy, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. www.micross.com
Micross' Advanced Test Facility, Silicon Turnkey Solutions (STS), located in Milpitas, CA is an industry-recognized collaborative partner that integrates design, engineering, manufacturing and qualification processes with operational expertise to provide leading edge technology and test services that enable customers to meet demanding time-to-market pressure, cost and technical challenges. Micross STS possesses more than 25 years of electronic test expertise.
Industry
Semiconductor Manufacturing, Electron tubes, Electrical & Electronic Components, Electrical & Electronic Equipment, Electric and electronic components - machines for manufacturing, MOSFET Drivers, Drivers, Machine Parts, Machinery, Tools & Supplies, Converters
HQ Location
1810 South Orange Blossom Trail
Apopka, FL 32703, US
Keywords
Bare DieDie & Wafer ProcessingComponent ModificatioCustom PackagingMIL-SPEC ConnectorsPEM-QualsRobotic Hot Solder DippingChip Scale PackagingEngineering & Analytical ServicesFull Turnkey Test Services