Blue Cheetah is advancing chiplet interconnectivity with its customizable die-to-die interconnect IP solutions. Its state-of-the-art semiconductor IP solutions achieve industry-leading power, performance, and area for high-performance computing, AI/ML, networking, mobile, and many other applications. The company's BlueLynx D2D interconnect subsystem IP provides customizable physical (PHY) and link layer chiplet interfaces and supports the Universal Chiplet Interconnect Express (UCIe) and Open Compute Project (OCP) Bunch of Wires (BoW) standards. Blue Cheetah provides its state-of-the-art IP solutions in 16nm, 12nm, 7nm, 6nm, 5nm, 4nm, and below across multiple semiconductor foundries. The IP supports versatile packaging options, including standard and advanced, supporting multiple bump pitches, metal stacks, and orientations. The physical (PHY) IP solutions integrate with on-die buses using popular standards like AMBA® CHI, AXI, and ACE. Blue Cheetah was founded in 2018, is headquartered in Sunnyvale, California, and is funded by founding investors Sehat Sutardja, Weili Dai, and NEA, which led the company's Series B round.