JB
Jakob Bollhalder
Head Of Compound And Photonics, Vice President at Evatec
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Work Experience
Jan 2020 - Present · 4 years and 11 months
Head Of Compound And Photonics, Vice President
Jan 2024 - Present · 11 months
Head Of Business Unit Optoelectronics
Dec 2022 - May 2024 · 1 years and 5 months
Product Marketing Manager
Jan 2020 - Dec 2022 · 2 years and 11 months
Company Details
501-1000 Employees
Welcome to Evatec - The Thin Film Powerhouse From LEDs to Lasers, Power Chips to Packaging Level solutions for EMI shielding, our thin film deposition and etch systems enable manufacture of the worlds highest performance optical, optoelectronic and semiconductor devices. Our Advanced Process Control (APC) technologies enables new level of thin film performance and production yield. We offer complete process solutions in our core markets of Advanced Packaging, Power Devices, MEMS, Wireless Technologies, Optoelectronics and Photonics. Read more about process technologies and our range of deposition platforms to see how we use our know how across optical , optoelectronics and semiconductor markets to enhance throughput and drive down cost of ownership. " In-situ" capabilities including optical pyrometry, plasma emission monitoring, film stress , electrical property and broadband optical monitoring delivery optimum film performance and production yields for next generation devices. Career Webpage: https://evatecnet.com/careers/jobs-at-evatec/ Youtube: https://www.youtube.com/@evatecag3161
Year Founded
2004
Social Media
LinkedinTwitter
Industry
Semiconductor Manufacturing, Electrical Products Manufacturing, Manufacturing Sector, Vacuum pumps, Engines & Parts, Mechanical Engineering & Industry - Equipment, Engineering - industrial contractors, Computer memories, Information technology (IT) and Internet, IT, Internet, R&D
HQ Location
Hauptstrasse 1a Trübbach, Sankt Gallen CH-9477, CH
Keywords
Photonics- from 3D Sensing and Gesture Recognition to HUDMEMS - OpticalMagnetic and RFPower Devices- Enabling next generatioWireless - Enabling 5GAdvanced Packaging- UBMRDL and Fan-out at both wafer and panel levelOptoelectronics- thin film solutions for LEDVCSEL and Micro-Display
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