Dynatex International has been the leader in dry process dicing and wafer dicing materials since 1958. We are committed to providing solutions for die/diode dicing and wafer processing applications -- solutions designed to increase yields, maximize throughput, and minimize operator intervention. With over five decades of experience, Dynatex International offers a strong base of technical accomplishment and business expertise to assist you with all your dicing needs.
Complete line of wafer dicing materials and equipmentDynatex offers over 5 decades of technical dicing and engineering expertiseComplete line of DTX dicing equipment designed specifically for MEMS/die singulation and laser diode cleaving.