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Danilo Sarmiento

Assistant Engineer at Chipbond Technology Corporation.
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About Danilo Sarmiento

Danilo Sarmiento is Assistant Engineer of Chipbond Technology Corporation. based in 力行五路3號 新竹市東區科學園區, 300, TW. Previously worked at G3 Systems Ltd as a Housekeeper Attendant. Chipbond Technology Corporation. is a Manufacturing, Electronic & Electrical company in 力行五路3號 新竹市東區科學園區, 300, TW with 167 employees.

Danilo Sarmiento has 15 years of professional experience, with an average of 3 years per position throughout their career. Their recent employment history shows 0 changes in the past 3 years, with high job stability. they do not have Fortune 500 company experience.

Danilo Sarmiento holds a degree from sto.rosario elementary school, with 22 years since graduation. Their career include experience at a global enterprise.

Danilo Sarmiento Social
Danilo Sarmiento Work
Danilo Sarmiento have been working for 15 years. Currently Danilo Sarmiento is the Assistant Engineer @Chipbond Technology Corporation., with experience in Housekeeper Attendant @G3 Systems Ltd
Assistant Engineer
2015 - Present · 10 years and 7 months
Housekeeper Attendant
Dec 2012 - Jan 2015 · 2 years and 1 months
philppines
Grill Man
Jul 2012 - Dec 2012 · 5 months
About Danilo Sarmiento's Current Company

Chipbond Technology Corporation. is founded in 1997, operates from its headquarter in 力行五路3號 新竹市東區科學園區, 300, TW. The company operates in the Manufacturing, Electronic & Electrical sector.

Chipbond Technology Corporation. specializes in Backend assembly processing of LCD driver ICs, Wafer bumping, Gold bumping, TCP or COF assembly process, LCD driver IC manufacturing, and offers services including Turnkey Service for backend assembly processing of LCD driver ICs, Wafer bumping, and Testing.

Chipbond Technology Corporation. has hired 1 new employees in the past 6 months..

Year Founded
1997
Social Media
Linkedin
IPO Status
Listed
Primary Industry
Manufacturing, Electronic & Electrical
HQ Location
力行五路3號 新竹市東區科學園區, 300, TW
Expertise
Backend assembly processing of LCD driver ICsWafer bumpingGold bumpingTCP or COF assembly processLCD driver IC manufacturing
Solutions
Turnkey Service for backend assembly processing of LCD driver ICsWafer bumpingTestingDicingPackagingTCP or COF assembly process
Keywords
Integrated Circuit PackagingSemiconductor AssemblyOsatChip PackagingElectronics ManufacturingAdvanced PackagingMicroelectronics AssemblySemiconductor ManufacturingWafer Level PackagingSemiconductor Testing
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Danilo Sarmiento Education

Danilo Sarmiento completed at sto.rosario elementary school (1997 - 2004) , at eastwoods international institute of science and technology (2008 - 2010) , etc

sto.rosario elementary school
1997 - 2004
eastwoods international institute of science and technology
management
2008 - 2010
Danilo Sarmiento Skills
Project and Plan Management
contract management, project planning, program management, management
Business and Strategy
operations management
Team and Leadership
leadership, military
Supply Chain and Process
procurement
Other
supervisory skills, vegetarian cooking, baking, glazing, mountain biking, military experience, bread, pastry, command, food, food service, first aid, mod, pole dancing, bing, cooking, weapons, ministry of defence, engineering management, military training, navy

Danilo Sarmiento Email & Phone number

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  • Email AddressD**@com.twPersonal Email
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  • Phone Number(xxx)xxx-xxxxPersonal Phone
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