RJR Technologies, Inc. is an integrated manufacturer of electronic packaging solutions for the RF/Wireless, telecom, medical, automotive, optical and vision industries. RJR offers eutectic die attachable injection molded LCP packages, pre-applied epoxy lids and sealing equipment. We offer our customers a turnkey solution, providing all necessary package components: epoxies, base, package and lid, and lidding equipment. RJR specializes in SOIC, QFN, LDMOS, MEMS, sensors, custom packaging, flip chip lids, desiccants, epoxies and hi-end sealing equipment.