Multibeam has re-innovated e-beam lithography to enable cost-effective production of leading-edge semiconductors for advanced packaging, photonics, rapid prototyping, and other special applications. It is the industry’s only maskless multi-column e-beam platform that offers full-wafer direct write patterning capabilities with fine resolution in a modular architecture that is optimized for scale. The fully automated system features multiple miniaturized e-beam delivery columns and advanced algorithms that enable precision patterning with fab-level productivity. Innovated by patterning and wafer fab equipment experts, our systems empower IC leaders to make patterns that are impossible, difficult, or too expensive for mask-based solutions, with breakthrough time-to-market advantages.