Tresky offers manual and semi-manual Die Bonding solutions for small and medium sized electronics assembly facilities, laboratories and R&D. For now 40 years, Tresky has been perfecting the art of creating handling and pick & place systems.
We invite you to discover our range of Die Bonding solutions, tools and services.
Semiconductor Manufacturing, Printed circuits, Electrical & Electronic Components, Electrical & Electronic Equipment, Passive electronic components and printed circuits, Optoelectronic equipment, Electronic equipment. Telecommunications equipment, Electrical, Electronics & Optical, Optoelectronic systems and equipment, Chip on Board (CoB)-Technik
HQ Location
Bönirainstrasse 13
Thalwil, Zürich 8800, CH
Keywords
fine placingFlip Chip BondingMicroassemblyMicropackagingEutectic Die BondingEpoxy Die BondingSolder Paste Die AttachSilver Sintering Die BondingThermocompression Die BondingDie Bonder