Inphocal

inPhocal uses a unique laser beam technology that will revolutionize the field of laser processing. The long focus depth of our beam will speed up laser marking systems. The long focus depth also allows for marking on curved surfaces without loss in quality. Our laser beam can also be focused down to smaller spot sizes than current technology. This results in higher precision for wafer dicing. This increases chip yield and can help solving our current global chip shortage problem.