Since 1980, Tresky has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
Tresky designs and manufacture high quality equipment for :
Die Attach, SMT, Hybrid, MCM, COB, Flip-Chip, Optoelectronic, Microsystemtechnic, and many more...
Industry
Semiconductor Manufacturing, Bestückung, Arzneimittel, Befestigungstechnik, Achsen, Bonden von Chips, Automobile, Linearmotoren, Granit, Flip-Chip-Bestückung
HQ Location
Neuendorfstr. 19 B
Hennigsdorf, 16761, DE
Keywords
DIE BonderFlipChip BonderDIE AttachUltrasonic BonderCustomized solutionsand ManualSemi.AutomaticFull Automatic