Six Sigma
Semiconductor Manufacturing, Ionic Contamination Testing Services, FCC Testing Services · 51 Employees
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About
The alteration and testing of microelectronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance.
Services include: robotic hot solder dip, column attach, ball grid array (BGA) to column grid array (CGA) conversions, ball attach, BGA reballing, and trim & form.
Testing includes:
solderability, fine & gross leak, bond pull, ball shear, XRF, failure analysis, and mark permanency.
Products include BGA preforms for ball attach or reballing.
Year Founded
1990
Social Media
Linkedin
Industry
Semiconductor Manufacturing, Ionic Contamination Testing Services, FCC Testing Services, Testing Services, Services, Humidity Testing, Acoustic Emission Retesting Services, Fatigue Testing Services, Aerospace Testing Services, Consumer Electronics Stores
HQ Location
905 Montague Expy
Milpitas, California 95035, US
Keywords
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Location
- 905 Montague Expy Milpitas, California 95035, US
Email Formats
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andywarhol@sixsigmaservices.com
first_initial + last
awarhol@sixsigmaservices.com
first + last_initial
andyw@sixsigmaservices.com
first
andy@sixsigmaservices.com
last
warhol@sixsigmaservices.com
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Semiconductor Manufacturing, Ionic Contamination Testing Services, FCC Testing Services
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