Shenzhen Able Electronics Co., Ltd. is a joint venture company which specializes in IC back-end processing. Established in 1994, our company has been the leading player in IC back-end processing industry since 1994 and building stable partnership and profound mutual trust with customers domestic and abroad. Our main business and services include:
a, testing for wafer/die level, including CP and final testing;
b, wafer back-grinding, dicing, sorting and packing;
c, COB bonding;
d, SMT processing;
e, IC packaging(primary packaging line for SOP8 has entered into mass production period since early 2011, with DIP, SOT, QFN, QFP packaging lines to follow soon).
Industry
Appliances, Electrical, and Electronics Manufacturing, Toothbrush, Oral Hygiene, Personal Care, Beauty & Personal Care
HQ Location
Building 2, Hesheng Industrial Zone, Sanlian, Buji Town, Longgang District
Shenzhen, Guangdong 518112, CN
Keywords
Wafer Back-grindingdicingsorting and packingCOB BondingSMTIC Packagingand CP and Final Testing for Wafer and Dies