Hi Tech Corp.

European manufacturer of complex PCB Prototypes Rigid, Rigid-Flex, Flex Boards, HDI boards up to 36 Layers -Blind via 0.1mm (Laser) -Buried via 0.1 mm -Laser via 0.075mm -Filling via (copper or non-conductive) -Plugged (via-filler SD-2361) - Conductor width /space 0.035mm - Sequential Lamination Stack Build - Impedance Control PCB thickness 0.063 to 6.4 mm Selective surface finish (ENIG /Hard Gold) Copper thickness 435 microns (finish) First Class base materials used (UL certified) -Express production in 1-4wd for Prototypes -Series Production in 7-10wd -Next day delivery (within EU) -The value for money -A Partner with high technological capability (equipment from Germany and Japan) and Statistically Controlled Processes