Hybond,
Semiconductor Manufacturing, Semiconductor Die Processing & Packaging, Radiation Processing Consulting Services · 2 Employees
Phone Number: engineering@hybond.com
Email Address: engineering@hybond.com
About
Hybond designs, manufactures, and sells thermosonic ball and wedge wire bonders, peg bonders, epoxy and silver-glass die bonders, eutectic and laser diode die bonders, pulsed heat fluxless, eutectic die attach station, DFS universal bonder test units, and adjustable height heated work stages. They provide their products for universities, colleges, institutes, aerospace, data storage, microwave, sensors and optical fiber telecommunications.
Website
Year Founded
1980
Social Media
Linkedin
Industry
Semiconductor Manufacturing, Semiconductor Die Processing & Packaging, Radiation Processing Consulting Services, Processing Services, Services, Semiconductor Assembly Equipment, Semiconductors, Electronic Equipment, Automation & Electronics, Assembly Machinery
HQ Location
330 STATE PLACE
ESCONDIDO, California 92029, US
Keywords
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Location
- 330 STATE PLACE ESCONDIDO, California 92029, US
Email Formats
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andywarhol@hybond.com
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awarhol@hybond.com
first + last_initial
andyw@hybond.com
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andy@hybond.com
last
warhol@hybond.com
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Semiconductor Manufacturing, Semiconductor Die Processing & Packaging, Radiation Processing Consulting Services
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