FlipChip International (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, Spheron™ WLCSP, ChipsetT™ Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, Arizona, USA, and Shanghai, China
Industry
Semiconductor Manufacturing, Packaging, Materials Handling, Electronic Engineering Services, Electronic, Engineering, Engineering & Consulting, Solder Balls, Balls, Machine Parts
HQ Location
3701 E University
Phoenix, Arizona 85034, US
Keywords
Semiconductor Wafer Solder Bumping (WLCSP)Multi Project WafersSemiconductor Assembly and TestBackgriWafer SawTape and ReelLaser MarkOrganization