F&S Bondtec
Semiconductor Manufacturing · 11 Employees
Email Address: info@fsbondtec.at
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About
F&S BONDTEC serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S BONDTEC can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.
Website
Year Founded
1994
Social Media
Linkedin
Industry
Semiconductor Manufacturing
HQ Location
Industriezeile 49a
Braunau am Inn, Upper Austria 5280, AT
Keywords
Wire BondingBond TestingCustomized Solutionsand Bond Training
Location
- Industriezeile 49a Braunau am Inn, Upper Austria 5280, AT
Email Formats
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first + last
andywarhol@fsbondtec.at
first_initial + last
awarhol@fsbondtec.at
first + last_initial
andyw@fsbondtec.at
first
andy@fsbondtec.at
last
warhol@fsbondtec.at
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Semiconductor Manufacturing
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