Disco Hi Tec Europe

Semiconductor Manufacturing, Machine tools, cutting - parts and accessories, Silicon wafer processing equipment · 51 Employees
Phone Number: dgs@discoeurope.com
Email Address: dgs@discoeurope.com
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About
DISCO HI-TEC EUROPE (DHE) is DISCO CORPORATION’s European head office. DHE’s services are focused on (but not limited to) Europe, the Middle East, Africa and Russia. Our portfolio includes sales and maintenance of DISCO’s machines and consumables, application support and Dicing-Grinding-Service (DGS). DGS and application tests are performed directly in DHE’s cleanroom/demo room in Munich. To provide the most advanced and up-to-date precision technology, we have excellent application engineers on site. Our engineers do not only optimize existing applications, but also research new methods of processing to meet new products. DHE is located in the east of Munich and easy to reach. You can get acquainted with our facilities on site and learn more about technical details in a personal meeting.
Year Founded
1982
Social Media
Linkedin
Industry
Semiconductor Manufacturing, Machine tools, cutting - parts and accessories, Silicon wafer processing equipment, Electronic equipment. Telecommunications equipment, Electrical, Electronics & Optical, Production machinery for the electronics industry, Etching machines, photo-engraving, chemical (plasma), Etching machines, photo-engraving, powderless, Werkstoffe, Leiterplatten
HQ Location
Liebigstraße 8 Kirchheim bei München, Bayern 85551, DE
Keywords
SemiconductorWafer thinningApplication TestsDicing SawsDicing-Grinding-ServiceMunich CleanroomProduction on siteAdvanced PackagingWafer Laser DicingStealth Dicing
Location
  • Liebigstraße 8 Kirchheim bei München, Bayern 85551, DE

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andywarhol@dicing-grinding.com
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awarhol@dicing-grinding.com
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andyw@dicing-grinding.com
first
andy@dicing-grinding.com
last
warhol@dicing-grinding.com
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