Today, 3S has a staff of more than 100 people, with a branch office in Shanghai, China, and service networks covering China, Malaysia, Philippines, Thailand, Singapore, Japan, and sales representatives all over the main semiconductor packaging center the world. We offer competitive power device assembly equipment. The kit we supply includes Stencil Printers, Die Bonder, Clip Die Bonder, Vacuum Reflow Oven, and Formic Acid Vacuum Reflow Oven. We also provide flux-free solder paste used in the Formic Acid Vacuum ReflowOven and an open lab for customers' product verification.
Industry
Machinery Manufacturing, IC Design, Packaging & Foundry, ICs, Electrical & Electronics, General Labware, Lab Supplies, Measurement & Analysis Instrument, Other Industrial Automatic Equipment & Smart Machinery, Industrial Automatic Equipment & Smart Machinery, Machinery
HQ Location
3F, 169-2, Sec.1, Kang-Le Road
Hsin-Feng Shiang, Hsin-Chu County , Taiwan 30444, TW